ST's HELIX research program with NUS will explore how memory, processing and software can be designed together for real-time ...

AST's 95,000-square-meter plant will produce large-body, high-layer-count substrates for AI computing and networking chips.

The agreement shifts Infineon's existing supply relationship with Wolfspeed to larger-diameter substrates for SiC ...

Higher component costs and longer replacement cycles weakened China’s smartphone market, while Huawei recorded double-digit ...

The new Singapore hub will consolidate regional logistics and shift sales operations closer to customers across Southeast ...

Global 300mm fab investment is set to accelerate through 2029, driven by expanding semiconductor manufacturing capacity and ...

Targeted enclosure upgrades can help engineers improve shielding above 40GHz while preserving existing cabinet architecture ...

OLED notebook panel shipments are forecast to rise 50% in 2026, driven by premium PCs, Apple adoption and manufacturing ...

TSMC turns to GlobalFoundries for silicon interposers to expand advanced packaging capacity and support future customer ...

Cellid will use Qualcomm's development platform to build reference designs and shorten AR glasses development cycles.

The software connects Tessent-generated test patterns with execution environments, including automated test equipment, system ...

NVIDIA and industry partners are applying accelerated computing and AI agents to chip simulation, process optimization, ...